China moves to build helium reserve as Nippon Sanso sets over 30% price hike
Jun 24, 2026, 10:46 pm By Sherri Wang
Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier,…TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
Jun 24, 2026, 10:39 pm By Charlene Chen
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry…AI server demand drives sharp price gains in high-end MLCCs
Jun 24, 2026, 10:35 pm By Jingyue Hsiao
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep…ProLogium and Elysian Aircraft sign MoU to explore solid-state batteries for electric aviation
Jun 24, 2026, 9:54 pm By DIGITIMES
ProLogium, a Taiwanese battery maker specializing in next generation lithium ceramic cells, has…MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
Jun 24, 2026, 9:51 pm By Jingyue Hsiao
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could…Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
Jun 24, 2026, 9:41 pm By DIGITIMES
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from…SK Hynix eyes record US$29.4 billion Nasdaq ADR to fund AI memory expansion
Jun 24, 2026, 9:30 pm By DIGITIMES
SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary…Anthropic accuses Alibaba of largest distillation attack on Claude, escalating the US-China AI fight
Jun 24, 2026, 9:04 pm By DIGITIMES
Anthropic's claim that Alibaba "illicitly" harvested its Claude model marks the biggest alleged case…OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon
Jun 24, 2026, 9:03 pm By DIGITIMES
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with…Acer Gadget sees double-digit growth as PC peripherals and smart living drive expansion
Jun 24, 2026, 8:33 pm By DIGITIMES
Acer Gadget said momentum in its core PC peripherals and smart living accessories businesses drove a…E Ink subsidiary scales solvent-free OCA to support higher-quality, lower-carbon displays
Jun 24, 2026, 8:30 pm By DIGITIMES
E.Comis Technology, a subsidiary of E Ink Holdings Group, said it has scaled a self-developed,…Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
Jun 24, 2026, 8:09 pm By DIGITIMES
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation…Micron forecasts stronger AI-driven growth as strategic agreements reshape memory market
Jun 24, 2026, 8:05 pm By DIGITIMES
On June 24, Micron Technology reported record fiscal third-quarter results and issued a…Foxconn and Sharp sign strategic pact to prioritize AI servers and smart infrastructure
Jun 24, 2026, 8:01 pm By DIGITIMES
Foxconn announced on June 24 that it signed a memorandum of strategic cooperation with Japan's Sharp…ITRI and 30 firms form Taiwan consortium to accelerate unmanned vehicle R&D and exports
Jun 24, 2026, 8:00 pm By DIGITIMES
In response to global non-red supply chain realignment and the need to develop key autonomous…SK Hynix to issue $29 billion in new shares for Nasdaq ADR listing on July 10
Jun 24, 2026, 6:06 am By DIGITIMES
SK Hynix disclosed in a regulatory filing to South Korea's Financial Supervisory Service on June 24…Imoo overtakes Samsung to become No. 4 smartwatch brand
Jun 24, 2026, 5:45 am By Lily Hess
Imoo beat Samsung Electronics, Oppo, and Garmin to rank as the world's No. 4 smartwatch brand in…SoftBank to build domestic AI server base as Japan pushes for sovereign compute
Jun 24, 2026, 5:42 am By Scarlett Yu
SoftBank, the telecom arm of SoftBank Group (SBG), is moving to localize a larger part of Japan's AI…Asia's AI data center boom turns green power into supply chain stress test
Jun 24, 2026, 5:36 am By DIGITIMES
Asia's AI infrastructure buildout is turning electricity into a new supply chain constraint. As…Global market for advanced chip packaging set for rapid expansion
Jun 24, 2026, 5:23 am By DIGITIMES
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow…
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